Building of an immunosensor: How can the composition and structure of the thiol attachment layer affect the immunosensor efficiency?

Type Article
Date 2006-09
Language English
Author(s) Briand Elisabeth1, 6, Salmain Michèle2, Henry Jean-Marie3, Perrot Hubert4, Compere ChantalORCID5, Pradier Claire-Marie1
Affiliation(s) 1 : Univ Paris 06, CNRS, UMR 7609, Lab React Surface, F-75252 Paris 05, France.
2 : Ecole Natl Super Chim, CNRS, UMR 7576, Lab Chim & Biochim Complexes Mol, F-75231 Paris, France.
3 : INRA, Unite Bioadhes & Hyg Mat, F-91300 Massy, France.
4 : Lab Interfaces & Syst Electrochim, UPR 15, F-75252 Paris 05, France.
5 : IFREMER, Dept Essais & Rech Technol Interface & Capteurs, F-29280 Plouzane, France.
Source Biosensors and Bioelectronics (0956-5663) (Elsevier), 2006-09 , Vol. 22 , N. 3 , P. 440-448
DOI 10.1016/j.bios.2006.05.018
WOS© Times Cited 82
Keyword(s) QCM, IRRAS, Thiol attachment, Immunosensor, Mixed SAM' s
Abstract Immunosensors, based on the immobilization of a model rabbit antibody on mixed self-assembled monolayers and Protein A as a linking agent on gold transducers, were elaborated and characterized at each step by modulated polarization-infrared spectroscopy (PM-IRRAS) and occasionally by atomic force microscopy (AFM) and quartz crystal microbalance (QCM). By testing two different mixed SAMs comprising 11-mercaptoundecanoic acid (MUA), together with either decanethiol (C9CH3) or mercaptohexanol (C6OH), the role of the chemical composition and structure of the antibody attachment layer upon the sensor performance was demonstrated. (c) 2006 Elsevier B.V. All rights reserved.
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Briand Elisabeth, Salmain Michèle, Henry Jean-Marie, Perrot Hubert, Compere Chantal, Pradier Claire-Marie (2006). Building of an immunosensor: How can the composition and structure of the thiol attachment layer affect the immunosensor efficiency? Biosensors and Bioelectronics, 22(3), 440-448. Publisher's official version : https://doi.org/10.1016/j.bios.2006.05.018 , Open Access version : https://archimer.ifremer.fr/doc/00000/1988/