FN Archimer Export Format
PT J
TI Development of an improved adhesive test method for composite assembly design
BT 
AF COGNARD, Jean Yves
   DAVIES, Peter
   GINESTE, B
   SOHIER, L
AS 1:;2:;3:;4:;
FF 1:;2:PDG-DOP-DCB-ERT-MS;3:;4:;
C1 ENSIETA, Lab Mecan Struct Navales, F-29806 Brest 09, France.
   ENS, Antenne Bretagne, F-35170 Bruz, France.
   IFREMER, Serv Mat & Struct, F-92980 Plouzane, France.
   Univ Bretagne Occidentale, Lab Rheol & Mecan Struct, F-29285 Brest, France.
C2 ENSIETA, FRANCE
   ENS, FRANCE
   IFREMER, FRANCE
   UNIV BRETAGNE OCCIDENTALE, FRANCE
SI BREST
SE PDG-DOP-DCB-ERT-MS
IN WOS Ifremer jusqu'en 2018
   copubli-univ-france
IF 2.184
TC 69
UR https://archimer.ifremer.fr/doc/2005/publication-765.pdf
LA English
DT Article
DE ;Finite element analysis;Adhesion
AB This study is concerned with improving performance of composite structures through the use of adhesive bonding, particularly for marine and underwater applications. Some preliminary results from tests on simple composite/composite assemblies are given first. Difficulty in modelling the failure of even these simple joints highlighted the need for more reliable constituent input data. The first objective was to define an experimental methodology enabling the adhesives of interest to be characterised up to failure. A metal metal assembly was considered, in order to concentrate on the analysis of the behaviour of thin adhesive films. The aims were to characterise the adhesive, analyse its non-linear behaviour, and study the influence of parameters such as film thickness and manufacturing conditions. In order to be able to study the behaviour of the adhesive as a function of the normal stress component, an important parameter, a modified Arcan fixture has been developed, which enables compression or tension to be combined with shear loads. First results from this fixture are presented, together with analysis of sources of scatter in results. 
PY 2005
PD MAR
SO Composites Science and Technology
SN 0266-3538
PU Elsevier
VL 65
IS 3-4
UT 000226769700003
BP 359
EP 368
DI 10.1016/j.compscitech.2004.09.008
ID 765
ER

EF